The MTSW11809SD520 is a high-quality, flexible board-to-board connector designed for versatile stacking and height customization in electronic assemblies. Featuring a black glass-filled polyester insulator and phosphor bronze contact material with gold or tin plating options, it operates efficiently from -55°C to +125°C. Suitable for various applications requiring high reliability and durability, this connector supports multiple configurations, including straight and right-angle versions, with customizable post heights and plating options, ensuring optimal electrical performance and mechanical stability.
Plating: Gold (tin optional), 50 microinches Ni underplating
Operating Temp Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Post Height: Specify in 0.005 inch increments
Contact Material: Phosphor Bronze
Plating Thickness: 50 microinches Ni
Version Options: Straight and right-angle (RA)
Dimensions: Length varies by configuration, post height and version
Compatible with multiple pitches and configurations for flexible design
Application: Board-to-board connections for electronic devices and systems
Buy the Samtec Series MTSW Board Connectors: MTSW11809SD520
Order the Samtec MTSW11809SD520 online today and enjoy a versatile, high-performance connector engineered for durability and reliable electrical connections. With customizable post heights, multiple versions, and plating options, this connector supports a wide range of electronic applications, ensuring secure and stable connections in complex systems. Designed to operate efficiently from -55°C to +125°C, it guarantees long-lasting performance and electrical reliability for your projects. Buy now to ensure your electronic assembly meets high standards of quality and performance.
Get Samtec MTSW11809SD520 today—built for precision and long-lasting durability with customizable heights and plating options.
Frequently Asked Questions
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You can click on the BUY or RFQ button to purchase MTSW11809SD520 from an authorized SAMTEC distributor.
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