The MTSW12009SD490LL series features high-density board-to-board connectors with a 2.54 mm pitch, suitable for various stacking applications. Made with black glass-filled polyester insulators and phosphor bronze contacts, these connectors provide excellent electrical performance and reliability. They support a wide operating temperature range from -55°C to +125°C with gold plating, ensuring durability in harsh environments. Designed for modularity, they come in straight and right-angle versions, with customizable post heights for flexible configurations. Compliant with RoHS standards, these connectors are ideal for complex electronic assemblies requiring precise interconnections.
Plating: 50 microinches (1.27 μm) Gold on post, additional platings available
Operating Temperature Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Number of Positions: 4, 6, 8, 10, 12, 14, 16, 18, 20, 22, 24, 26, 28, 30
Post Height: Specify in inches, increments of 0.005" (0.13 mm), customizable
Connector Style: Straight and Right-Angle Versions
Pitch: 2.54 mm, 0.100"
Build Type: Non-standard, non-returnable series, with modular stacking flexibility
Temperature Rating: -55°C to +125°C with gold plating, -55°C to +105°C with tin plating
Buy the Buy Samtec MTSW12009SD490LL Part Number MTSW12009SD490LL Online
Order the Samtec MTSW12009SD490LL series online to ensure your electronic projects benefit from high-density stacking connectors with customizable post heights. Their durable construction with gold plating supports wide temperature ranges from -55°C to +125°C, ideal for demanding environments. These connectors feature black glass-filled polyester insulators and phosphor bronze contacts, providing excellent electrical performance. Available in straight and right-angle styles, each with various pin counts, these connectors deliver reliable interconnections essential for high-performance electronics, ensuring your assembly’s flexibility and durability.
Buy Samtec MTSW12009SD490LL now and experience unmatched reliability and high-density interconnections for complex electronic assemblies.
Frequently Asked Questions
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