The MTSW series connector offers significant stacking flexibility with various height options, tailored post heights, and optional polarization for optimal PCB and terminal connections. Made with black glass-filled polyester insulators and phosphor bronze contacts with gold or tin plating, these connectors operate within a temperature range of -55°C to +125°C. Designed for reliable electrical contact and mechanical stability, these modular connectors support multiple configurations, ensuring high performance in complex electronic assemblies. Suitable for PCB applications requiring precise pin alignment and durability under demanding conditions, the MTSW series ensures dependable connectivity with customizable features.
Operating Temperature Range: -55°C to +125°C with gold, -55°C to +105°C with tin
Dimensions: Post height specify in inches (.005" increments), OAL varies by model
Electrical: Supports high current with stable contact resistance
RoHS Compliant: Yes
Lead-Free Solderable: Yes, compatible with wave soldering
Configurations: Straight and right-angle versions with optional polarization
Format: Modular stacking with up to 42 positions depending on configuration
Certifications: RoHS compliant, designed to meet industry standards
Buy the Buy Samtec MTSW Series Connector Part Number MTSW12311GS697 Online
Enhance your electronic assembly with the versatile Samtec Connector Module, offering precise stacking, adjustable post heights, and durable contacts with gold or tin plating. Designed for PCB reliability, these connectors support high-temperature operation from -55°C to +125°C and are RoHS compliant. Suitable for complex configurations, they ensure secure connections with optional polarization and support both straight and right-angle versions. Trust Samtec’s expertise in delivering high-performance, customizable interconnect solutions ideal for demanding industrial and electronic projects. Purchase online now for fast, reliable delivery and technical support.
Buy Samtec MTSW12311GS697 now and experience unmatched reliability and performance in high-density electronic stacking applications.
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