The MTSW connector series offers high flexibility for stacking and board-to-board applications. Constructed with black glass-filled polyester insulators and phosphor bronze contacts, these connectors feature gold and tin-plated finishes, ensuring durability and reliable electrical performance. Suitable for operating temperatures from -55°C to +125°C with gold plating and up to +105°C with tin, they are RoHS compliant and lead-free. Available in multiple post heights and configurations, these connectors are ideal for custom electronic systems where precise stacking and connection reliability are crucial. Designed for industry-standard applications, they support high-density mounting and versatile mounting options for complex assemblies.
Operating Temp Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Post Heights: Specify in inches, increments of 0.005" (0.13 mm)
Dimensions: Vary by model, typical post height options include 0.090" to 1.290"
Contact Material: Phosphor Bronze
Number of Positions: Varied configurations for multiple pin counts
Design: Straight and Right-Angle versions available
Application: Board stacking, electronic system interface, high-density connectors
Buy the Buy Samtec MTSW Series Connector Part Number MTSW13222GD375 Online
Purchase the Samtec MTSW stacking connector today online to ensure your electronic systems achieve optimal connectivity, flexibility, and durability. Designed for high-density applications, this connector series offers multiple post heights, reliable gold or tin plating, and RoHS compliance. With easy soldering and versatile configurations, it simplifies complex assembly requirements. Whether for prototype or production, buying online provides quick access to industry-leading connectors that support your demanding electronic projects with lasting performance and precise fitting. Order now to enhance your system’s reliability and connectivity options.
Buy Samtec MTSW13222GD375 now and experience unmatched reliability and performance in high-density electronic connections.
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