High-flexible board-to-board connector featuring a 2.54 mm pitch with enhanced stacking flexibility, ideal for modular electronic systems requiring customizable heights and robust electrical connections. Constructed with black or natural polyester insulator material and phosphor bronze terminals plated with gold or tin, ensuring durable contact performance across a temperature range of -55°C to +125°C. Suitable for applications demanding RoHS compliance, lead-free soldering, and reliable operation in diverse mechanical environments. Designed to provide high-density connections with various post heights and configurations for versatile integration.
Insulator Material: Black Glass Filled Polyester or Natural Liquid Polyester
Terminal Material: Phosphor Bronze with Gold or Tin Plating
Operating Temp Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
Pitch: 2.54 mm (0.100 inch)
Post Heights: Variable, specify in increments of 0.005 inch
Plating Thickness: 50 microinches (1.27 μm) Nickel over Gold or Tin
RoHS Compliant: Yes
Lead-Free Solderability: Yes, suitable for wave soldering
Versions: Straight and Right-Angle (RA) configurations
No. of Positions: Variable, customizable by application
Builds to Samtec specifications, subject to change without notice
Buy the Buy Samtec MTSW13224GD270 Part Number MTSW13224GD270 Online
Purchase the Samtec MTSW13224GD270 flexible board connector online today to ensure your electronic projects benefit from high-density, customizable interconnection options. Featuring a 2.54 mm pitch, various post heights, gold and tin plating, and RoHS compliance, this connector offers reliable, long-lasting performance in rugged environments. Ideal for engineers and technicians seeking versatile, high-quality solutions for modular assemblies, the MTSW13224GD270 provides secure electrical contact, easy installation, and broad compatibility, simplifying complex system designs and ensuring optimal operation across diverse applications.
Get Samtec MTSW13224GD270 today—designed for high-flexibility, reliable connections, and durable performance in modular electronic assemblies.
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