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SAMTEC MTSW13608GD140 High-Density Interconnect System

The MTSW series is a flexible interconnect system designed for high-density applications, offering customizable post heights, gold or tin plating, and various orientations such as straight or right-angle configurations. Manufactured with robust materials like black glass-filled polyester insulators and phosphor bronze contacts, these connectors are RoHS compliant and suitable for operating temperatures from -55°C to +125°C. Ideal for PCB stacking, board-to-board, or wire-to-board connections, with specifications including a 2.54 mm pitch, high current capacity, and optional polarization for secure mating in demanding electronic assemblies.

Authorized Distributors
Source:DigiKey
Part No:MTSW-136-08-G-D-140
Stock:94
Inv Date:05-27-2026
Price: Unit price: $18.08
Buy/RFQ:
Source:DigiKey
Part No:MTSW-136-08-G-D-140
Stock:0
Inv Date:05-27-2026
Price: Unit price: $6.5
Buy/RFQ:
Part No:MTSW-136-08-G-D-140
Stock:19
Inv Date:05-28-2026
Price: Unit price: $6.5
Buy/RFQ:
Part No:MTSW-136-08-G-D-140
Stock:0
Inv Date:05-27-2026
Price: Unit price: $8.1
Buy/RFQ:
Part No:MTSW-136-08-G-D-140
Stock:0
Inv Date:05-27-2026
Price: Unit price: $8.1
Buy/RFQ:
Part No:MTSW-136-08-G-D-140
Stock:94
Inv Date:05-28-2026
Price: Unit price: $72800
Buy/RFQ:

SAMTEC MTSW13608GD140 High-Density Interconnect System Specifications:

  • Insulator Material: Black Glass Filled Polyester
  • Terminal Material: Phosphor Bronze
  • Plating: 50μ
  • Operating Temp Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
  • RoHS Compliant: Yes
  • Pitch: 2.54 mm
  • Post Height: Specify in inches (increments of 0.005 inches)
  • Dimensions: Length varies with configuration, typical termination length approximately 0.600 inches
  • Configurations: Straight or Right-Angle, polarized options available
  • Contact Material: Phosphor Bronze
  • Plating Options: Gold (50 μ
  • Tin
  • Compatibility: Suitable for PCB stacking, wire-to-board, high-density electronic assemblies
  • Temperature Range: -55°C to +125°C (Gold), -55°C to +105°C (Tin)

Buy the Samtec Series HMTSW High-Density Interconnect: MTSW13608GD140

Enhance your electronic assemblies with the Samtec High-Density Interconnect System. Featuring customizable post heights, gold or tin plating, and versatile orientations like straight or right-angle, it ensures secure and reliable connections. Crafted from durable materials such as glass-filled polyester and phosphor bronze contacts, these connectors operate effectively across a broad temperature range. Designed for PCB stacking, wire-to-board, or other high-density applications, this system guarantees performance, flexibility, and RoHS compliance. Order online now to improve your manufacturing efficiency and connection integrity.

Buy Samtec HMTSW13608GD140 now and experience unmatched reliability and performance in high-density electronic connections.

Frequently Asked Questions

Where can I buy SAMTEC MTSW13608GD140?

You can click on the BUY or RFQ button to purchase MTSW13608GD140 from an authorized SAMTEC distributor.

How do I troubleshoot issues or seek technical support for part MTSW13608GD140?

You can download the MTSW13608GD140 datasheet or visit the SAMTEC website for support.

Who is the manufacturer of MTSW13608GD140?

SAMTEC

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