The MTSW series features high-density stackable right-angle and straight pin headers suitable for industrial applications requiring reliable interconnect solutions. Made with black glass-filled polyester insulators and phosphor bronze contacts, they offer exceptional stability and corrosion resistance. Operating temperature ranges from -55°C to +125°C with gold plating and up to +105°C with tin plating. Available in various post heights, these flexible connectors support board-to-board and cable-to-board configurations. Compliant with RoHS standards, they are ideal for complex electronic assemblies needing precise alignment and durable connectivity.
Plating: 50 microinch (1.27 micrometers) Nickel with Gold or Tin
Operating Temperature Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Post Height: Specify in inches; increments of 0.005" (0.13mm)
Versions: Straight and Right-Angle options available
Number of positions: Varies per configuration
Dimensions: Length varies with post height, typical in the range of approximately 0.25 to 1.29 inches
Uses: Board-to-board, cable-to-board connections in industrial and electronic applications
Buy the Samtec MTSW-126-08-T-S-229-RA – Reliable High-Density Interconnect for Industrial Applications
Purchase the Samtec High-Density Stackable Header series today online to ensure reliable, durable, and precise connections in your industrial and electronic projects. These headers support board-to-board and cable-to-board configurations with various post heights, plated with gold or tin for enhanced durability and corrosion resistance. RoHS compliant, and suitable for operating temperatures from -55°C to +125°C, they offer excellent performance in demanding environments. Order now to streamline your manufacturing process and guarantee high-quality interconnects for your critical applications.
Order your Samtec Series MTSW-126-08-T-S-229-RA today and give your projects the dependable quality they deserve, perfect for complex electronic assemblies requiring flexible interconnects.
Frequently Asked Questions
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