High-density, rectangular board-to-board connector with a 2.54 mm pitch, featuring gold plating on the contact post for enhanced reliability and corrosion resistance. Constructed with black glass-filled polyester insulator and phosphor bronze contacts, it offers excellent electrical and mechanical performance suitable for complex electronics applications. Designed to support rugged, high-temperature environments up to 125°C with RoHS compliance. Compatible with various post heights for flexible assembly, making it ideal for dense electronic assemblies requiring robust connectivity with precise alignment and maximum stacking flexibility.
Plating: Gold (Au) on post, 50 µin (1.27 µm) Nickel underlayer
Operating Temp Range: -55 °C to +125 °C with Gold plating, -55 °C to +105 °C with Tin plating
RoHS Compliant: Yes
Post Height: Specify in inches, at 0.005 inch (0.13 mm) increments
Pitch: 2.54 mm (0.100")
Current Rating: 1.0 A per contact
Voltage Rating: 250 V AC/DC
Contact Resistance: Typically less than 10 mΩ
Dielectric Withstanding Voltage: 500 V AC for 1 minute
Sizes: Single and double row options, with vertical and right-angle configurations
Design: Support for various lead styles and stack heights for dense electronic assemblies
Certifications: RoHS Compliant
Buy the Samtec MTSW13610GD240 – Reliable Board-to-Board Connector for Industrial Applications
Purchase the Samtec MTSW13610GD240 board-to-board connector online today and benefit from flexible stacking options, gold-plated contacts, and robust construction. Perfect for high-density electronic assemblies requiring reliable electrical performance and precise alignment. With a 2.54 mm pitch, RoHS compliance, and support for multiple post heights, this connector ensures excellent durability and ease of installation. Secure your supply chain by buying online now and get fast delivery of this essential component for reliable, high-performance electronic systems.
Order your Samtec Series MTSW13610GD240 connector today and enhance your electronic projects with dependable, high-performance connectivity.
Frequently Asked Questions
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