The high-speed ground plane socket is a polarized board-to-board connector designed with liquid crystal polymer insulators and phosphor bronze contacts, plated with 50 microinches of gold over nickel for enhanced durability. It supports operating temperatures from -55°C to +125°C, with a current rating of 1.8 A per pin and 23.1 A per ground plane. Suitable for applications requiring high reliability, this socket features integral metal planes for power or ground, RoHS compliance, and multiple stacking options. It’s ideal for high-speed, high-density electronic assemblies demanding robust and precise connections.
Plating: 50 yp" (1.27 um) Ni with 30 p" (0.76 um) Gold
Current Rating: 1.8 A per pin, 23.1 A per ground plane
Operating Temp: -55 °C to +125 °C
Voltage Rating: Not specified
RoHS Compliant: Yes
Lead-Free Solderable: No
Board Stacking: Up to 2 connectors per board, 60 total positions per bank
No. of Positions per Row: 20, 25, 30, 40, 50, 60
Maximum Cycles: Not specified
Dimensions: 11mm & 16mm heights, 20.00 mm pitch, other options available
Processing: Compatible with SMT, coplanarity within 0.004" (0.10mm), non-standard options may be non-returnable
Certifications: RoHS compliant
Buy the Samtec QSS05001LDA – Reliable High-Speed Ground Plane Socket for Industrial Applications
Purchase the high-speed ground plane socket from Samtec online today to ensure your electronic projects benefit from precise, durable connections. This socket features durable gold-plated contacts, supporting high current and temperature ranges for demanding applications. Designed with liquid crystal polymer insulators and phosphor bronze contacts, it supports multiple stacking configurations and offers RoHS compliance. Ideal for high-speed, high-density environments, this socket provides reliable performance for advanced electronic systems, ensuring your projects meet strict industrial standards with ease.
Order your Samtec Series QSS05001LDA high-speed ground plane socket today and give your projects the dependable quality they deserve, ensuring robust connections for high-density electronic assemblies.
Frequently Asked Questions
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