This high-quality edge mount header features a black liquid crystal polymer insulator, phosphor bronze terminal material with gold or matte tin plating, and operates within a temperature range of -55°C to +125°C. Suitable for various PCB applications, it has a voltage rating of 475 VAC, supports current ratings up to 54 A per pin, and features lead-free solderability. Designed with coplanarity, compatibility with multiple mating components, and available with locking clips and shrouds, it ensures robust and reliable electrical connections in demanding environments.
SAMTEC TSM11702TSHP Edge Mount Header Specifications:
Insulator Material: Liquid Crystal Polymer
Terminal Material: Phosphor Bronze
Plating: Gold-Au or Matte Tin
Operating Temp Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
Voltage Rating: 475 VAC
Current Rating: Up to 54 A per pin
Lead-Free Solderable: Yes
Lead Coplanarity: 0.15 mm max with -DH/-SH, 0.10 mm max with -DV/-SV
RoHS Compliant: Yes
Number of Positions: 2 to 30
Contact Type: Board to board
Certification: RoHS compliant
Application: PCB connections in electronic systems
Mounting: Edge Mount
Compatible with: SSW, BCS, SSM, IDSS, IDSD, HLE
Dimensions and Style: Style -01, -02, or -03, with options for polarized, TR, and shrouded configurations
Buy the Buy Samtec TSM11702TSHP Part Number TSM11702TSHP Online
Purchase the Samtec Edge Mount Header TSM11702TSHP online today for your PCB application needs. This connector offers high current capacity, RoHS compliance, and excellent durability. Its design ensures robust electrical connections with its lead-free, solderable terminals and coplanarity features. Suitable for complex electronic systems, it supports multiple configurations, including polarized and shrouded options. Order now to enhance your electronic assembly with a reliable, high-quality connector built to meet rigorous industry standards and ensure long-lasting performance.
Get Samtec TSM11702TSHP today—designed for high current capacity and reliable PCB connections in demanding electronic applications.
Frequently Asked Questions
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