This high-reliability board connector features a black liquid crystal polymer insulator and phosphor bronze terminals with gold and matte tin plating, designed for extensive PCB applications. It operates within a temperature range of -55°C to +125°C (with gold plating) and supports a voltage rating of 475 VAC. The connector is RoHS compliant, with a current rating of up to 54 A per pin, and features optional locking clips and shrouds for secure connections. Suitable for automated manufacturing, it provides rugged, high-performance electrical connectivity for industrial and electronic systems.
Operating Temperature Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
Voltage Rating: 475 VAC
Current Rating: 54 A per pin
Insulator Material: Black Liquid Crystal Polymer
Terminal Material: Phosphor Bronze
Plating: Gold (Au) and Matte Tin
RoHS Compliant: Yes
No. of Positions: 2 to 30
Lead-Free Solderable: Yes
Lead Coplanarity: 0.15 mm (0.006") maximum
Operating Temp Range: -55°C to +125°C with Gold plating
Compatible with various mating connectors such as SSW, BCS, SSM, IDSS, IDSD
Designed for automated assembly and reliable electrical connections in industrial electronics
Buy the Samtec Series TSM: Board Mates for PCB Connectors TSM11801SDVA
Experience reliable performance with the Samtec Board Connector TSM11801SDVA, featuring a robust liquid crystal polymer insulator, gold and tin plating, and a temperature range up to 125°C. Perfect for industrial electronics, it supports 54 A per pin and 475 VAC, ensuring safe, efficient power transfer. Designed for automated assembly, this connector offers easy installation, high durability, and compliance with RoHS standards. Enhance your electronic systems with our high-quality, versatile connector for PCB applications.
Get Samtec TSM11801SDVA today—built for high current capacity and durable PCB connections.
Frequently Asked Questions
Where can I buy SAMTEC TSM11801SDVA?
You can click on the BUY or RFQ button to purchase TSM11801SDVA from an authorized SAMTEC distributor.
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