Shrouded .025 inch square post IDC headers are compact, reliable connector solutions suitable for board-to-board applications. Made from insulating polyester with optional gold or tin plating, these connectors offer high insulation resistance and operate safely from -55°C to +125°C. They feature phosphor bronze contacts with optional gold or tin over nickel plating, ensuring excellent electrical conductivity and corrosion resistance. Suitable for both automated SMT assembly and wave soldering, they include polarized and locking options for mechanical stability, making them ideal for dense electronic assemblies in industrial equipment and control systems.
Operating Temp Range: -55°C to +125°C with Gold plating, -55°C to +105°C with Tin plating
Plating: Au or Sn over Ni
Contact Material: Phosphor Bronze
Number of Positions: 5, 7, 8, 10, 12, 13, 15, 17, 20, 25, 32, 36
Termination Style: IDC
Flammability Rating: UL 94V-0
RoHS Compliant: Yes
Board Spacing: 2.54 mm (0.100 inch)
Max Lead Height: 1.430 inches, 36 positions
Operating Voltage: 1000 VRMS
Current Rating: 2 A per contact
Contact Resistance: Low, specific values depend on configuration
Mechanical Features: Polarized, locking leads, suitability for wave and SMT assembly
Special Options: Alignment pins, mechanical stability enhancements, various plating options
Buy the Buy Samtec TST10702TDLL Part Number TST10702TDLL Online
Purchase the Samtec TST10702TDLL shrouded IDC header online today to ensure reliable, high-quality connections. Designed for dense electronic assemblies, these headers feature precise insulation and optional gold or tin plating for durability. Their robust construction supports operating temperatures from -55°C to +125°C, making them suitable for industrial applications, control panels, and automation systems. Easy to install with polarized and locking features for mechanical stability, they optimize space and performance, delivering dependable electrical connections for your projects.
Buy Samtec TST10702TDLL now and experience unmatched reliability and high-performance board-to-board connectivity in your electronics.
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