The TSW series from Samtec features unshrouded terminal strip headers designed for through-hole mounting, with 0.025-inch square posts compatible with multiple connector series. These connectors are available in various configurations including single, double, or triple rows, with optional locking features to ensure secure connections. They offer a pitch of 2.54mm, operate within temperature ranges of -55°C to 105°C, and utilize phosphor bronze terminals with black glass-filled polyester insulators. Compliant with UL and CSA standards, these connectors ensure signal integrity and durability in electronic applications.
Insulator Material: Black Glass Filled Polyester (TSW) or Natural Liquid Crystal Polymer (HTSW)
Terminal Material: Phosphor Bronze
Plating: 50 µin Nickel over 50 µin Gold on post, Tinned or Gold on terminals
Operating Temp Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
Voltage Rating: Up to 550 VAC depending on configuration
Configurations: Single, Double, or Triple rows with locking options
Compliance: RoHS, UL and CSA standards
Application: Through-hole mounting, signal and power connections
Buy the Samtec Series TSW Terminal Headers: TSW11209TD
Enhance your electronic projects with the Samtec Terminal Header series TSW11209TD. Featuring 2.54mm pitch, multiple configurations, and high-temperature operation, these headers ensure secure and durable connections. Perfect for through-hole mounting, they come with gold or tin plating options, meeting RoHS, UL, and CSA standards. Easy to install and compatible with various connector series, the TSW series provides reliable signal integrity for industrial, automation, and consumer electronics applications. Order online today for fast delivery and dependable performance.
Buy Samtec TSW11209TD now and experience unmatched reliability and performance for your electronic connection needs.
Frequently Asked Questions
Where can I buy SAMTEC TSW11209TD?
You can click on the BUY or RFQ button to purchase TSW11209TD from an authorized SAMTEC distributor.
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