Shrouded quad row headers with .025° square post design, mating with strip per row connectors. Features include gold or tin plating, high insulation resistance, and operating temperatures from -55°C to +125°C. Suitable for dense electronic assemblies requiring reliable, polarized connections. Variants include different sizes, pre-tinned or gold-plated contacts, and alignment options. Compliant with RoHS standards, these headers are ideal for high-performance, surface-mount applications in industrial and commercial electronics, offering durable mechanical stability and precise electrical connectivity.
Plating: Au (gold flash), Sn (tin), Ni over various options
Operating Temperature Range: -55°C to +125°C (gold), -55°C to +105°C (tin)
Insulation Resistance: ≥5000 MΩ min
Flammability Rating: UL 94V-0
Withstanding Voltage: 4,000 VRMS
Lead Style: Optional lead plating options and configurations
Dimensions vary by size, typical length 13.72 - 36.32 mm, height 13.72 - 34.04 mm
Number of Positions: Range from 2 to 10 or more depending on model
Surface Mount: Yes, with optional coplanarity specifications
RoHS Compliant: Yes
Non-standard sizes and options available, contact Samtec for details
Mechanical stability enhanced with optional spacers
Compatible with Samtec IDC and stacker connectors
Buy the Buy Samtec ZSS10509SD1240 Part Number ZSS10509SD1240 Online
Order the Samtec ZSS10509SD1240 shrouded square post header online today to ensure secure, high-density connections for your electronic projects. Featuring gold or tin plating, these headers provide excellent electrical performance with high insulation resistance and stable operation across a wide temperature range. Designed for surface-mount applications, they are RoHS compliant and offer enhanced mechanical stability for demanding environments. Reliability and quality are guaranteed—make your purchase now to streamline your assembly process and improve product durability with trusted Samtec standards.
Buy Samtec ZSS10509SD1240 now and experience unmatched reliability and high-density dense electronic connections in your assembly.
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