Shrouded 0.025-inch square post IDC headers are designed for reliable board-to-board connections with secure insulation and corrosion-resistant plating. Made from high-quality insulator material, these headers feature gold or tin plating over phosphor bronze contacts, ensuring excellent electrical conductivity and durability under temperature ranges from -55°C to +125°C. They comply with UL 94V-0 flammability rating and RoHS standards. Suitable for various electronics and industrial applications, these headers offer mechanical stability, easy SMT installation, and a range of sizes from 5 to 36 positions for versatile configurations.
SAMTEC ZST11002TD640 Square Post IDC Headers Specifications:
Insulator Material: Filled Polyester
Insulation Resistance: Not specified
Terminal Material: Phosphor Bronze
Plating: Au or Sn over Ni
Current Rating: 2 A per contact
Operating Temp Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
Flammability Rating: UL 94V-0
Withstanding Voltage: 1000 VRMS
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Contact Pitch: 0.025 inch
Number of Pins: Options from 5 to 36
Physical Dimensions: 0.64 mm thick, various lengths per size
Compatibility: SMT, wave soldering
Additional Features: Polarized, mechanically stable for multiple configurations
Buy the Samtec Series ZST Shrouded Square Post IDC Headers: ZST11002TD640
Order Samtec ZST Series square post IDC headers online today to ensure secure, high-quality board-to-board connections. These headers feature durable phosphor bronze contacts with gold or tin plating, supporting temperatures up to 125°C. They are RoHS compliant and suitable for SMT applications, offering easy installation and mechanical stability. With various sizes available from 5 to 36 pins, these headers are ideal for reliable electronic assemblies in industrial, consumer, and communication devices. Purchase now for fast delivery and dependable performance in your next project.
Buy Samtec ZST11002TD640 shrouded square post IDC headers now and experience unmatched reliability and performance in high-density electronic connections.
Frequently Asked Questions
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