Shrouded 0.025-inch square post IDC headers are reliable connectors designed for high-density applications. They feature natural LCP or black glass insulators, gold or tin plating, and operate efficiently within temperature ranges of -85°C to +125°C depending on the surface finish. These headers support various pin counts, with optional polarized and locking leads for enhanced connectivity. RoHS compliant and suitable for wave or SMT soldering, they are ideal for electronic assemblies requiring robust, high-performance connections in automotive, industrial, and consumer electronics.
Insulator Material: Natural LCP or Black Glass Polyester
Plating: Gold or Tin over Nickel
Operating Temp Range: -85°C to +125°C with Tin, -85°C to +125°C with Gold
Current Rating: Supports high-current applications (specific value not provided)
RoHS Compliant: Yes
Lead Finish: Matte Tin or Gold
Number of Pins: Varies based on configuration, typically 2 to 36
Pin Spacing: 0.025 inches (0.635 mm)
Insulation Resistance: Not explicitly specified but supports high insulation resistance
Surface Mount and Through Hole: Supports wave and SMT soldering
Mechanical Stability: Enhanced with optional alignment pins and locking leads
Certifications: UL Listed, RoHS compliant
Temperature Range: -85°C to +125°C with Gold, -85°C to +105°C with Tin
Buy the Buy Samtec ZST-113-03-F-D-0735 Part Number ZST12502TD640 Online
Purchase the Samtec ZST-113-03-F-D-0735 shrouded IDC header online today to ensure robust and high-performance connectivity in your electronic projects. These headers are designed for versatile applications, offering options that include gold or tin plating, polarized configurations, and support for wave and SMT soldering methods. With excellent temperature tolerance from -85°C to +125°C and RoHS compliance, they deliver reliability and durability for industrial, automotive, and consumer electronic devices. Secure your components with ease and efficiency by buying online now.
Buy Samtec ZST-113-03-F-D-0735 now and experience unmatched reliability and high-density connectivity for your electronic assemblies.
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