The product is a flexible, high-quality electronic connector designed for reliable signal transmission. Constructed with durable materials like black glass-filled polyester and natural liquid crystal polymer, it features gold and tin plating options for enhanced conductivity and corrosion resistance. It operates effectively within a temperature range of -55°C to +125°C. The connector's high pin density and tailored length make it ideal for complex, space-constrained electronic assemblies, ensuring strong mechanical stability with optional spacers. Certified RoHS compliant, it is suitable for lead-free applications and offers optimal performance in demanding environments.
Insulator Material: Black Glass-filled Polyester, Liquid Crystal Polymer
Terminal Material: Phosphor Bronze with Gold or Tin Plating
Plating: Gold flash on contact area, matte tin on tail
Operating Temperature Range: -55°C to +125°C (Gold), -55°C to +105°C (Tin)
RoHS Compliant: Yes
Lead-Free Solderable: Yes (HW), No (DW, EW, ZW)
Overall Length: 6.35 mm (0.25 inch)
Connector Height: 7.87 mm (0.31 inch)
Maximum Pin Density: Multiple pins with optional tail length customization
Mechanical Stability: Enhanced with optional spacers
Applications: Space-constrained electronic assemblies, high-reliability signal connectors
Buy the Samtec Series Flexible Connectors High-Density: ZW1114GD1040160
Purchase the Samtec flexible connector ZW-06-13-L-D-787-118 online today to ensure superior signal integrity and mechanical stability in your electronic projects. Crafted with durable, RoHS-compliant materials, this connector features gold and tin plating for corrosion resistance, and its compact design suits space-constrained environments. Its range of customizable options, including tail length and pin configurations, makes it versatile for demanding applications. Order now for fast shipping and get top-tier quality for your complex, high-reliability electronic assemblies, backed by expert support.
Buy Samtec ZW-06-13-L-D-787-118 connector now and experience unmatched reliability and performance in high-density electronic applications.
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