The product is an electronic connector with a stacker design, featuring a phosphor bronze terminal with gold and tin plating options. It operates within a temperature range of -55°C to +125°C with gold plating and -55°C to +105°C with tin. Made with black glass-filled polyester insulator material, it offers RoHS compliance, solderability, and mechanical stability for high-reliability applications. Suitable for board-to-board connections, this connector includes flexible tail lengths, robust construction, and is designed for industrial electronics requiring durable, high-performance interconnects.
Plating: Gold flash on contact area, Matte Tin on tail
Operating Temp Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Solderability: Lead-Free, RoHS-compliant, suitable for wave soldering only with lead
Overall Length: As specified per model, tail length variation from approximately 2.29 mm to 7.87 mm
Maximum Stack Height: 6 parts
Mechanical Stability: Enhanced with optional board spacers for gold or selective gold plating
Design: Stackable for high-density PCB connections, with optional tail length customization
Certifications: RoHS compliant, manufactured to international standards for electronic components
Temperature Range: -55°C to +125°C (Gold), -55°C to +105°C (Tin)
Buy the Samtec ZW2010SS – Reliable Stacker Connectors for Industrial Applications
Enhance your electronic assemblies with the high-performance stacker connector designed for durability and reliable connections in industrial environments. Featuring gold and tin plating options, RoHS compliance, and customizable tail lengths, this connector ensures optimal electrical performance and mechanical stability. Easy to assemble and compatible with various PCB configurations, it is ideal for demanding applications requiring robust, high-quality interconnect solutions. Order online today to benefit from fast delivery and excellent support for your engineering projects.
Buy Samtec ZW2010SS now and experience unmatched reliability and performance in high-density electronic interconnections.
Frequently Asked Questions
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