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TE CONNECTIVITY 223492011 High-Speed I/O Interconnect

The zSFP+ pluggable I/O interconnect is among the fastest single-channel connectors, supporting data rates up to 28 Gbps NRZ and 56 Gbps PAM-4. Compatible with SFP+ interfaces, it offers hot-swappability for easy upgrades from 10-16 Gbps to higher speeds, including 28 Gbps and 56 Gbps. It’s used in telecommunications, data centers, and networking equipment for high-speed data transmission, with various configurations like stacked, ganged, and surface-mount designs. The connector ensures mechanical robustness, EMI containment, and optional light pipes for signal integrity.

Authorized Distributors
Source:Newark
Part No:2-2349201-1
Stock:6
Inv Date:06-09-2026
Price: Unit price: $45.03
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Source:DigiKey
Part No:2-2349201-1
Stock:9
Inv Date:06-09-2026
Price: Unit price: $222.27
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Source:DigiKey
Part No:2-2349201-1
Stock:2
Inv Date:06-09-2026
Price: Unit price: $192.9
Buy/RFQ:
Part No:2-2349201-1
Stock:9
Inv Date:06-10-2026
Price: Unit price: $203.76
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Part No:2-2349201-1
Stock:0
Inv Date:06-09-2026
Price: Unit price: $367.45
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Part No:2-2349201-1
Stock:2
Inv Date:06-09-2026
Price: Unit price: $266.88
Buy/RFQ:
Part No:2-2349201-1
Stock:2
Inv Date:06-09-2026
Price: Unit price: $266.88
Buy/RFQ:
Part No:2-2349201-1
Stock:1
Inv Date:06-09-2026
Price: Unit price: $196.59
Buy/RFQ:

TE CONNECTIVITY 223492011 High-Speed I/O Interconnect Specifications:

  • Data rates: Up to 28 Gbps NRZ and 56 Gbps PAM-4, 10 Gbps Ethernet, 16 Gbps Fibre Channel
  • Voltage (max.): 120V AC
  • Current (max.): 0.5A
  • Operating Temperature: -40 to +85°C
  • Material: High-temperature thermoplastic housing, nickel-silver cage, high-performance copper alloy contacts
  • Plating: Nickel underplating, tin on solder tail, gold or palladium nickel options
  • Physical dimensions: Varies with configuration, designed for PCB mounting and stacking applications
  • Durability: Minimum 250 mating cycles
  • Mechanical forces: Mating force of 25N, un-mating force of 11.5N
  • Certification: RoHS compliant, suitable for high-speed optical and electrical interconnects
  • Additional features: EMI containment gaskets, light pipe options, various port configurations

Buy the TE Connectivity 223492011 – Reliable High-Speed I/O Interconnect for Industrial Applications

Enhance your networking and telecommunications infrastructure with the high-speed TE Connectivity zSFP+ interconnect. Supporting data rates up to 28 Gbps and compatible with SFP+ form factors, it offers reliable performance, easy hot-swappable integration, and flexible configurations including stacked and ganged options. Designed for operations from -40°C to +85°C, its durable construction ensures long-term service life. Upgrade your systems today and benefit from seamless high-speed data transfer, EMI containment features, and versatile deployment options to meet your evolving business demands.

Buy TE Connectivity zSFP+ interconnect now and upgrade your high-speed data transmission systems with proven reliability and performance.

Frequently Asked Questions

Where can I buy TE CONNECTIVITY 223492011?

You can click on the BUY or RFQ button to purchase 223492011 from an authorized TE CONNECTIVITY distributor.

How do I troubleshoot issues or seek technical support for part 223492011?

You can download the 223492011 datasheet or visit the TE CONNECTIVITY website for support.

Who is the manufacturer of 223492011?

TE CONNECTIVITY

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