The zSFP+ pluggable I/O interconnect offers high-speed data transfer up to 28 Gbps NRZ and 56 Gbps PAM-4, compatible with SFP+ modules. It features a surface-mount design for easy PCB assembly, superior signal integrity through coupled contact beam geometry, and backward compatibility with existing SFP+ cages and connectors. Available in configurations supporting multiple ports, it includes options for EMI containment and heat sinks, making it suitable for telecommunications, data centers, medical equipment, and networking applications. Designed for -40 to +85°C operation, it ensures reliable performance in demanding environments.
Plating: Nickel underplating; Tin plating on solder tail; Gold plating on mating area
Physical Dimensions: Compatible with standard SFP+ cage footprint, multiple port configurations
Mechanical: Mating force 25N, un-mating force 11.5N, durability minimum 250 cycles
Certifications: UL Listed, RoHS compliant
Buy the Molex Series zSFP+ I/O Interconnect: 23435226
Enhance your network infrastructure with the high-speed Molex zSFP+ interconnect, supporting data rates up to 28 Gbps. This versatile, backward-compatible solution fits seamlessly into existing SFP+ cages, offering easy upgrades for telecom, data centers, and networking. Its robust construction, thermal stability, and reliable performance ensure top-tier operation in demanding environments. Available in multiple configurations with EMI containment and heat sink options, it’s ideal for high-performance applications. Purchase online today and boost your system’s efficiency and scalability with confidence.
Buy Molex zSFP+ 23435226 now and experience unmatched reliability and high-speed data transfer for advanced telecommunications and data center needs.
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TE CONNECTIVITY
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