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TE CONNECTIVITY 323435223 zSFP+ Interconnect

The zSFP+ pluggable I/O interconnect provides high-speed data transfer rates up to 28 Gbps NRZ and 56 Gbps PAM-4, supporting applications like Ethernet, Fibre Channel, and telecommunications. Compatible with SFP+ modules, it features a surface-mount design, superior signal integrity, and various configurations for density and system flexibility, including high-temperature thermoplastic housing, copper alloy contacts with gold and tin plating, and EMI containment options. Its rugged construction allows operation from -40°C to +85°C, ensuring reliable performance in data centers, medical, and networking environments. The product supports hot-swapping, multiple port configurations, and is compliant with industry standards like SFF-8402.

Authorized Distributors
Source:DigiKey
Part No:3-2343522-3
Stock:6
Inv Date:06-09-2026
Price: Unit price: $60.88
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Source:DigiKey
Part No:3-2343522-3
Stock:236
Inv Date:06-09-2026
Price: Unit price: $46.8
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Part No:3-2343522-3
Stock:0
Inv Date:06-10-2026
Price: Unit price: $47.31
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Part No:3-2343522-3
Stock:0
Inv Date:06-09-2026
Price: Unit price: $123.56
Buy/RFQ:
Part No:3-2343522-3
Stock:236
Inv Date:06-09-2026
Price: Unit price: $122.52
Buy/RFQ:
Part No:3-2343522-3
Stock:236
Inv Date:06-09-2026
Price: Unit price: $122.52
Buy/RFQ:
Part No:3-2343522-3
Stock:156
Inv Date:06-09-2026
Price: Unit price: $51.23
Buy/RFQ:

TE CONNECTIVITY 323435223 zSFP+ Interconnect Specifications:

  • Data Rates: Up to 28 Gbps NRZ and 56 Gbps PAM-4
  • Supported Protocols: 10G Ethernet, 16G Fibre Channel
  • Voltage (max.): 120V AC
  • Current (max.): 0.5A
  • Operating Temperature: -40 to +85°C
  • Housing Material: High-temperature thermoplastic, UL 94V-0
  • Contacts: Copper alloy with gold and tin plating
  • Dimensional Compatibility: Same mating interface as SFP+
  • Mating Force: 25N, Unmating Force: 11.5N
  • Durability: Min. 250 cycles
  • In-line testing available for electrical compliance
  • Configuration: Single high cage, stacked, 1x1 to 1x6 ports, multiple configurations
  • EMI Options: Elastomeric gasket, spring fingers for containment
  • Heat sinks, LEDs, light pipes available
  • Compliance: Industry standards including SFF-8402
  • Physical: Nickel-silver cage, high-performance copper contacts, operating from -40°C to +85°C

Buy the TE Connectivity 323435223 – Reliable High-Speed Interconnect for Industrial Applications

Enhance your networking and data systems with the high-speed zSFP+ interconnect, supporting up to 28 Gbps data transfer. Its backward compatibility with SFP+ modules makes upgrading seamless, ensuring optimal signal integrity and reliable operation from -40°C to +85°C. Designed for data centers, telecommunications, and medical equipment, this durable and versatile interconnect features flexible configuration options, EMI containment, and industry-standard compliance. Purchase online today for fast delivery and dependable performance in your critical applications.

Order your TE Connectivity 323435223 today, and equip your systems with the high-performance, robust interconnect solution designed for demanding environments.

Frequently Asked Questions

Where can I buy TE CONNECTIVITY 323435223?

You can click on the BUY or RFQ button to purchase 323435223 from an authorized TE CONNECTIVITY distributor.

How do I troubleshoot issues or seek technical support for part 323435223?

You can download the 323435223 datasheet or visit the TE CONNECTIVITY website for support.

Who is the manufacturer of 323435223?

TE CONNECTIVITY

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