Techspray No-Clean desoldering braid offers a superior solution for removing solder without leaving behind harmful ionic flux residues. These residues can lead to dendrite formation, causing short circuits and latent failures that impact product quality and reliability. This braid is coated with a no-clean flux, eliminating the need for post-soldering cleaning. Available in various sizes and lengths, including ESD-safe options, it's ideal for electronics manufacturing, rework, and repair applications. It meets or exceeds MIL-F-14256, NASA NHB 5300, 4 (34-1), NASA NPC 200-4, NASA SP5002, and IPC Standard-J-STD-004.
You can click on the BUY or RFQ button to purchase 182110F from an authorized Techspray distributor.
You can download the 182110F datasheet or visit the Techspray website for support.
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