TECHSPRAY 1978-DP Datasheet & Stock

The 1978-DP is a Silicone-free Heat Sink draws heat away when applied to a component. In electronics heat sink compound is generally used to thermally bond a component with a mechanical heat sink. For electrical application, it is used with thermocouple wells, thermistors and calrods or wherever efficient cooling is required. Ideal for electronic applications where silicone contamination hurts solder ability and increase solder defects. It is in the form of gray paste.




Thermal conductivity 0.92W/mK

-40 to 392°F Functional temperature range

Non-ozone depletion

Avoids solder defects due to silicon contamination

Will not separate

Will not harden and crack

296°C Flash point

>204°C Boiling point





Applications


Consumer Electronics,

Maintenance & Repair