This is a passive heat sink designed for BGA packages, featuring a pin array configuration. It is finished with black anodization for improved durability and corrosion resistance, providing effective thermal management for electronic components.
You can click on the BUY or RFQ button to purchase 65825ABT1 from an authorized WAKEFIELD distributor.
You can download the 65825ABT1 datasheet or visit the WAKEFIELD website for support.
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