This BGA heatsink model BGASTD065 features a compact 27.8 x 27.8 mm footprint with an 11.2 mm height, designed for effective heat dissipation of GPU and CPU components. Supplied with thermal pads and acrylic adhesive tape, it offers excellent thermal conductivity and reliable attachment. Constructed with high-quality materials such as aluminium foil and adhesive layers, it provides thermal resistance and stability across operating temperatures. Its precise dimensions and thermal properties ensure efficient cooling performance especially suited for high-performance electronic devices and assemblies.
Discover the efficient cooling solution with the BGA heatsink BGASTD065, designed for optimal heat dissipation in compact electronic devices. Featuring high thermal conductivity and easy attachment via acrylic adhesive tape, this heatsink ensures stable operation of GPU and CPU components. Its precise dimensions, lightweight aluminium construction, and high-quality thermal interface materials provide superior performance. Ideal for electronics manufacturers, repair technicians, and system integrators seeking reliable, easy-to-install cooling solutions for high-density PCB assemblies.
You can click on the BUY or RFQ button to purchase BGASTD065 from an authorized ABL Aluminium Components distributor.
You can download the BGASTD065 datasheet or visit the ABL Aluminium Components website for support.
ABL Aluminium Components