This product features a high-performance BGA heatsink designed for efficient thermal management of integrated circuit packages. Equipped with thermal tape for easy attachment, it ensures excellent heat dissipation for MPU, chipsets, and other plastic components. Made with a durable aluminum foil backing and a high-conductivity acrylic adhesive, it provides reliable thermal interface properties. Its compact size and adhesive strength allow secure placement on vertical surfaces and enclosures, making it suitable for compact electronic assemblies needing effective heat control and enhanced thermal performance.
Secure the highest quality BGA heatsink online today with ABL’s BGASTD090. Designed for optimal thermal dissipation, this heatsink features thermal tape for simple attachment to MPU and chipsets. Made from durable aluminum foil with high thermal conductivity, it ensures efficient heat transfer and protection for your electronic components. Its compact size, reliable adhesive properties, and easy-to-apply design make it ideal for managing heat in various electronic assemblies. Make your purchase today for superior device performance and longevity.
You can click on the BUY or RFQ button to purchase BGASTD090 from an authorized ABL Aluminium Components distributor.
You can download the BGASTD090 datasheet or visit the ABL Aluminium Components website for support.
ABL Aluminium Components