This high-performance heatsink pad is designed for efficient heat dissipation in electronic components. Supplied with acrylic adhesive, it features excellent thermal conductivity of 0.95 W/m·K and a total thickness of 0.27 mm, ensuring reliable heat transfer and insulation. The pad's high-temperature resistance allows it to withstand operating conditions up to 130°C, making it ideal for attaching heat sinks to MPU, chipsets, and other plastic components. Its adhesive properties ensure strong attachment, suitable for vertical mounting and metal enclosure surfaces, enhancing device longevity and performance.
Enhance your electronic device cooling with the ABL BGASTD115 thermal interface pad. Featuring high thermal conductivity of 0.95 W/m·K and a durable acrylic adhesive, it ensures optimal heat transfer and secure attachment to MPU, chipsets, and plastic enclosures. The pad resists temperatures up to 130°C, providing reliability in demanding conditions. Its adhesive properties allow for easy installation, even on vertical surfaces, making it an excellent choice for electronics engineers and technicians seeking dependable thermal management solutions for various applications.
You can click on the BUY or RFQ button to purchase BGASTD115 from an authorized ABL Aluminium Components distributor.
You can download the BGASTD115 datasheet or visit the ABL Aluminium Components website for support.
ABL Aluminium Components