High-density D-Subminiature connectors are robust, compact, and designed for high-density packaging needs in data, industrial, communication, medical, and embedded applications. They feature 15 to 78 positions with option for press-fit, solder, or crimp contacts, compliant with RoHS standards, and withstand up to 500 mating cycles. Made of glass-filled thermoplastic insulators, copper alloy contacts, and steel shells, these connectors operate between -55°C and +105°C, offering rated currents of 2.5A and voltages of 250V, ensuring reliable high-speed data and power transmission in demanding environments.
Contact Resistance: 25mΩ max. initial, 40mΩ max. after use
Insulation Resistance: 5000MΩ min. at 500V DC
Dielectric Strength: 750V RMS
Operating Temperature Range: -55°C to +105°C
Number of mating cycles: 200 (standard), 500 (high performance)
Contact Types: Solder pin, socket, crimp
Mounting Options: PCB, panel, press-fit, screw.
RoHS compliant
Available in various configurations including straight and right-angle forms, multiple pin counts, and mounting styles.
Buy the Fci HS Density Connector – Reliable High-Density Interconnect for Industrial Applications
Enhance your electronic system with our high-density D-Subminiature connectors. Designed for durability, versatility, and high-performance data and power transfer, these connectors support multiple mounting and contact options, are RoHS compliant, and withstand extensive mating cycles. Perfect for industrial, medical, and communication applications, they ensure secure connections in demanding environments. Easy to install with various configurations, they are a reliable choice for engineers seeking quality and long-term performance in high-density interconnect solutions.
Buy Fci high-density D-Subminiature connectors now and experience unmatched reliability and performance for your advanced data and power systems.
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