AMPHENOL COMMUNICATIONS SOLUTIONS 1011482810202LF 1.25mm Wire-to-Board Connector The AMPHENOL COMMUNICATIONS SOLUTIONS 1.25mm wire-to-board connector series offers a robust and versatile solution for connecting wires to printed circuit boards. Designed for industrial, automotive, and consumer applications, these connectors feature polarized housings to prevent mis-mating, friction-equipped crimping housings, and halogen-free resin material for environmental compliance. Available in straight and right-angle configurations, surface mount and through mount options, and with various plating options like matte tin, gold flash, and gold over nickel, this series provides flexibility for diverse PCB applications. It conforms to industry safety standards and offers excellent electrical and mechanical performance, making it suitable for demanding environments.
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AMPHENOL COMMUNICATIONS SOLUTIONS 1011482810202LF 1.25mm Wire-to-Board Connector Specifications: Contact: Copper Alloy Plating: Matte tin, gold flash, 15µin. gold, 30µin. gold over nickel Housing: Thermoplastic or thermoplastic, high temperature, UL94V-0 Metal hold down: Copper Alloy Mating & Un-mating Force: conforms to EIA-364-13 Contact Retention Force: 0.5Kgf min. Hold down/Housing retention force: 1.0Kgf min. Wire retention force: 0.5Kgf min. Terminal/Housing retention force: 0.5Kgf min. Vibration: 1µs max., EIA-364-28 Condition I Shock: 1µs max., EIA-364-27A Durability: 30 cycles Contact Resistance: 20mΩ max. Insulation Resistance: 100MΩ min. Voltage Rating: 125V AC, DC Current Rating: 1A (0.8A -32 AWG) Dielectric Withstand Voltage: 500V AC/minute Resistance to reflow soldering heat: Pre-heat: 150°C to 180°C, 60 - 90 seconds; Heat: 230°C min., 40 seconds min.; Peak Temperature: 260°C max., 10 seconds max. Resistance to hand soldering heat: Soldering iron: 350±10°C, Duration: 3 - 4 seconds min. Thermal Shock: conforms to EIA-364-32A Humidity: conforms to EIA-361-31A Temperature Life: conforms to EIA-361-17A, 105°C for 96 hours Salt Spray: conforms to EIA-364-26B Solderability: solderable area to have min. 95% solder coverage Product Specifications: GS-12-675 Packaging Specifications: GS-14-1592; GS-14-1593 Buy the 10114828-10202LF AMPHENOL COMMUNICATIONS SOLUTIONS 1.25mm Wire-to-Board Connector | myMectronic Securely purchase the AMPHENOL COMMUNICATIONS SOLUTIONS 10114828-10202LF connector and ensure reliable connectivity for your applications.
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Who is the manufacturer of 1011482810202LF? AMPHENOL COMMUNICATIONS SOLUTIONS
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