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AMPHENOL COMMUNICATIONS SOLUTIONS 1011482811104LF 1.25mm Wire-to-Board Connector

The FCI 1.25mm wire-to-board connector series offers a robust solution for connecting wires to PCBs in a wide range of industries. Designed with a 1.25mm pitch, these connectors provide a compact and reliable connection. Key features include fully polarized housings to prevent mis-mating, friction on the crimping housing, halogen-free resin material for environmental compliance, and a high flammability rating (UL94V-0). Available in straight and right-angle configurations, surface mount and through-mount options, and with various plating options (Matte tin, gold flash, 15µin. gold, and 30µin. gold), this connector series caters to diverse PCB applications and meets stringent industry standards like RoHS and IEC 60695-2.

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Source:Newark
Part No:10114828-11104LF
Stock:2956
Inv Date:06-01-2026
Price: Unit price: $0.136
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Source:DigiKey
Part No:10114828-11104LF
Stock:3944
Inv Date:06-01-2026
Price: Unit price: $0.45
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Part No:10114828-11104LF
Stock:1025
Inv Date:06-02-2026
Price: Unit price: $0.45
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Part No:1011482811104LF
Stock:0
Inv Date:06-01-2026
Price: Unit price: $0.28
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Part No:10114828-11104LF
Stock:1500
Inv Date:05-30-2026
Price: Unit price: $0.2619
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Part No:10114828-11104LF
Stock:4500
Inv Date:05-30-2026
Price: Unit price: $0.2619
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Part No:10114828-11104LF
Stock:607
Inv Date:06-02-2026
Price: N/A
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AMPHENOL COMMUNICATIONS SOLUTIONS 1011482811104LF 1.25mm Wire-to-Board Connector Specifications:

  • Contact: Copper Alloy
  • Plating: Matte tin, gold flash, 15µin. gold, 30µin. gold over nickel
  • Housing: Thermoplastic or thermoplastic, high temperature, UL94V-0
  • Metal hold down: Copper Alloy, Matt Tin
  • Mating & Un-mating Force: conforms to EIA-364-13
  • Contact Retention Force: 0.5Kgf min.
  • Hold down/Housing retention force: 1.0Kgf min.
  • Wire retention force: 0.5Kgf min.
  • Terminal/Housing retention force: 0.5Kgf min.
  • Vibration: 1µs max., EIA-364-28 Condition I
  • Shock: 1µs max., EIA-364-27A
  • Durability: 30 cycles
  • Contact Resistance: 20mΩ max.
  • Insulation Resistance: 100MΩ min.
  • Voltage Rating: 125V AC, DC
  • Current Rating: 1A (0.8A -32 AWG)
  • Dielectric Withstand Voltage: 500V AC/minute
  • Resistance to reflow soldering heat: Pre-heat: 150°C to 180°C, 60 - 90 seconds; Heat: 230°C min., 40 seconds min.; Peak Temperature: 260°C max., 10 seconds max.
  • Resistance to hand soldering heat: Soldering iron: 350±10°C, Duration: 3 - 4 seconds min.
  • Thermal Shock: conforms to EIA-364-32A
  • Humidity: conforms to EIA-361-31A
  • Temperature Life: conforms to EIA-361-17A, 105°C for 96 hours
  • Salt Spray: conforms to EIA-364-26B
  • Solderability: solderable area to have min. 95% solder coverage
  • Product Specifications: GS-12-675
  • Packaging Specifications: GS-14-1592; GS-14-1593
  • RoHS Compliance: conforms to EU Directive 2002/95/EC
  • UL Approval: Yes
  • Housing connector: conforms to IEC 60695-2 Industry Safety Standard (Glow Wire test)

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