The BergStak 0.40mm self-alignment connector offers a compact, high-performance solution for reliable board-to-board connections in automotive and electronic applications. Featuring a fine pitch of 0.40mm and a self-aligning mechanism, it supports blind mating and high-speed data transfer up to 8Gb/s. With a stack height of 3.50mm and modular design extending from 30 to 60 positions, this USCAR-2 compliant connector withstands harsh environments, vibration, and shock. Made from high-temperature thermoplastic and copper alloy, it ensures durability, safety, and environmental compliance. Ideal for constrained spaces, automation, and automotive electronics.
Positions: 30 (extendable to 60 in 10-position increments)
Material Housing: High temperature thermoplastic UL94V-0 black
Terminal Material: Copper alloy
Metal Hold-down: Copper alloy
Current Rating: 0.3A per contact
Voltage Rating: 30V AC
Insulation Resistance: 50MQ min.
Durability: 30 mating cycles
Operating Temperature Range: -40°C to +125°C
Vibration and Shock: Meets USCAR-2 Class V1 standards
Packaging: Tape & Reel
Compliance: USCAR-2, RoHS, halogen and lead-free
Environmental: Resists SO2 gas exposure for 96 hours
Buy the Amphenol 10142890030A3EHLF – Reliable Self-Aligning Board-to-Board Connector for Industrial Applications
Order the Amphenol self-aligning connector now for superior performance in automotive, automation, and electronics projects. This 0.40mm pitch connector features blind mating support, a modular design from 30 to 60 positions, and excellent environmental resistance. Its high-temperature thermoplastic housing and copper alloy contacts ensure long-lasting durability, safety, and compliance with industry standards like USCAR-2. Perfect for space-constrained applications requiring high-speed data transfer up to 8Gb/s, this connector delivers reliable, secure, and efficient connections for advanced electronic systems.
Get Amphenol 10142890030A3EHLF today—built for precise connections, high durability, and automotive-grade reliability in demanding environments.
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