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AMPHENOL COMMUNICATIONS SOLUTIONS 101470752600RLF MicroSpeed Board-to-Board Connector
The Amphenol MicroSpeed connector family offers a 1.00mm pitch solution for high-speed data applications, supporting transfer rates up to 25Gbps. Its shielded design provides superior EMC performance and electromagnetic compatibility, making it suitable for industrial automation, computing, medical technology, and telecommunications. The connector's poka-yoke polarization prevents mismating, while the dual-beam contact ensures robust and reliable connections. It is RoHS compliant and available in various configurations including right-angle, vertical, and combo options, catering to diverse application needs.
AMPHENOL COMMUNICATIONS SOLUTIONS 101470752600RLF MicroSpeed Board-to-Board Connector Specifications:
- Supports high-speed performance: up to 25Gb/s
- EMC shielding: reduces coupling inductance
- Contact design: dual-beam for robust application
- Mating feature: blind-mating
- PCB orientation: supports multiple applications
- Housing material: High temperature thermoplastic LCP, black (UL94V-0)
- Terminal & Shield Material: Copper alloy
- Plating (Mating Area): Gold and PdNi over nickel
- Plating (Termination Area): Tin over nickel
- Current Rating: 1A per contact, 10A per shield
- Voltage Rating: 500V(AC RMS, 60Hz)
- LLCR: 50m Ω max.
- Insulation Resistance: 1x1010 Ω min.
- Data Rate: up to 25Gbps
- Multiline Crosstalk: < 0.5% at 50ps (10-90%)
- Differential Impedance: 100 Ω
- Single Ended Impedance: 50 Ω
- Durability: 500 cycles
- Mating Force: 1N max. per contact
- Un-mating Force: 1N max. per contact
- Gauge Retention Force: 0.1N min. per contact
- Coplanarity: 0.1mm max. at termination area
- Operating Temperature: -55°C ~ 125°C
- Industrial Atmosphere Durability: 10 days
- Vibration: 20g
- Shock: 50g
- UL Listing: E66906
- Packaging: Tape & reel
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AMPHENOL COMMUNICATIONS SOLUTIONS