The BergStak 0.8mm Mezzanine Connector by Amphenol provides a high-density, high-speed parallel board-to-board connection suitable for various applications. Featuring a compact 0.8mm pitch, it supports up to 12Gb/s data transfer and offers durability for 100 mating cycles. Constructed with UL94V-0 rated glass-filled LCP housing and high spring copper alloy contacts, the connector includes multiple packaging, plating options, and optional PCB locator pegs. Its versatile design ensures reliable, precise engagement for high-performance electronic systems in industrial, communication, and server applications.
Contact Area Finish: Gold or Gold flash over Palladium-nickel
Solder Area Finish: Matte pure Tin over Nickel
Mating Cycles: 100
Mating Force: 0.9N max./contact
Unmating Force: 0.1N min./contact
Insulation Resistance: Initial 100MQ min., After test 100MQ min.
Current Rating: 0.8A/contact
Contact Resistance: Initial 30mΩ max., After test 50mΩ max.
Voltage Rating: 100VAC
Impedance Range: 81 to 108Ω @ 50 ps edge
Return Loss: < 10dB up to 5GHz
Insertion Loss: < 1.5dB up to 5GHz
Temperature Range: -40°C to +125°C
Certifications: UL, RoHS compliant
Buy the Amphenol Series BergStak 0.8mm Mezzanine Connector: 61082102400LF
Discover the high-performance BergStak 0.8mm Mezzanine Connector designed for high-speed, high-density electronic applications. With support up to 12Gb/s and a robust UL94V-0 housing, this connector ensures reliable connections in industrial, server, and communication systems. Featuring easy-mating, durability for 100 cycles, and multiple plating and packaging options, it’s ideal for precise, high-performance applications requiring compact, durable, and environmentally compliant solutions. Purchase online today for fast, secure delivery and elevate your electronic system’s connectivity.
Buy Amphenol BergStak 0.8mm Mezzanine Connector now and experience unmatched high-speed data transfer and reliable high-density connectivity.
Frequently Asked Questions
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AMPHENOL COMMUNICATIONS SOLUTIONS
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