The PV wire-to-board connector system features a robust crimp-to-wire design that ensures high reliability, durability, and retention through 1000 mating cycles. Suitable for various applications including instrumentation, medical, industrial equipment, automotive electronics, and data communications, it offers options for single and double rows with polarized MINI-LATCH housings to prevent mis-mating. The connectors include high-quality brass and beryllium copper contacts with gold or pure tin plating. They support wire diameters up to 1.52mm, withstand voltage of 1000V RMS, and temperatures from -40°C to +105°C, ensuring dependable performance in demanding environments.
Plating: Gold or pure tin over nickel for contacts, RoHS-compliant parts available
Electrical: Current rating 3.0A, withstand voltage 1000V RMS, insulation resistance >10000MQ (wire), >5000MQ (header), contact resistance <2mQ
Mechanical: Durability 1000 cycles, mating force 450g (high spring), 100g (ultra-high spring), un-mating force 75g (high spring), 175g (ultra-high spring)
Temperature Range: -40°C to +105°C
Wire Diameter: Max 1.52mm, compatible with wires AWG 22-32
Connectors include single and double row configurations, polarized, support for quick tooling, and crimping tools
Certifications: URE66906, CSALR46923
Buy the Buy FCI PV Wire-to-Board Connector Part Number 76384305LF Online
Secure your electronic projects today by ordering the FCI PV wire-to-board connector 76384305LF online. Designed for high reliability, these connectors support up to 1.52mm wire diameter, with polarized housings that prevent mis-mating. Ideal for industrial, medical, automotive, and data communication applications, they feature durable brass and beryllium copper contacts with gold or tin plating for dependable, long-lasting connections. Supporting a temperature range from -40°C to +105°C, this connector ensures your electronics perform safely and reliably under demanding conditions.
Order your FCI PV wire-to-board connector 76384305LF today and enhance your project with high reliability and durable performance in electronic assemblies.
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