A low-profile Dual In-line Package (DIP) component designed for space-constrained electronic applications. Suitable for various circuit board integrations requiring a compact form factor.
You can click on the BUY or RFQ button to purchase SDA09H0SBR from an authorized C&K COMPONENTS distributor.
You can download the SDA09H0SBR datasheet or visit the C&K COMPONENTS website for support.
C&K COMPONENTS