This is a card edge connector designed for reliable connections in electronic assemblies, with a contact spacing of 0.100 inches (2.54 mm). It supports various mounting options including floating eyelets with a .116 inch (2.95 mm) diameter and offers a tail size of 0.025 x 0.013 inches (0.64 x 0.33 mm). The connector features a total of 26 contacts and a tail length of 0.375 inches (9.53 mm), making it suitable for compact, high-density circuit designs. Constructed from UL 94V-0 thermoplastic polyester insulator material and copper, nickel, tin alloy contacts with gold and tin plating, it ensures durability and optimal electrical performance across temperatures from -65°C to +105°C.
Insulator Material: Thermoplastic Polyester, UL 94V-0
Contact Material: Copper, Nickel, Tin Alloy CA-725
Contact Plating: Gold on Mating Area, Tin on Contact Tails, Nickel Underplate
Current Rating: 3 Amperes Continuous
Contact Resistance: 10 Milliohms Maximum
Dielectric Withstanding Voltage: 1200 V AC rms at Sea Level Between Adjacent Contacts
Insulation Resistance: 5000 Megohms Minimum
Operating Temperature: -65 to +105 Degrees C
Mounting Options: Floating Eyelets with .116 inch (2.95 mm) Inside Diameter
Construction: UL Recognized, Thermoplastic Polyester Insulator, Copper/Nickel/Tin Alloy Contacts with Gold and Tin Plating
Buy the Electronic Component Series Card Edge Connector: 341 Series 26 Pins
Order the high-quality card edge connector from our online store today. Designed with a 0.100 inch contact spacing, 26 contacts, and flexible mounting options, this connector offers durability and optimal electrical performance. Made from UL 94V-0 thermoplastic polyester and plated with gold and tin for corrosion resistance, it supports temperatures from -65°C to +105°C. Perfect for compact circuit designs, this reliable connector ensures secure connections and easy integration into electronic systems, making it the ideal choice for your assembly needs.
Buy 341 Series 26 Pin Card Edge Connector now and experience unmatched reliability and performance for high-density electronic applications.
Frequently Asked Questions
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