The Wire Wound Chip Inductor is designed for high-frequency RF applications, including cellular phones, wireless LAN, and RF modules. It features compact sizes such as 0402, 0603, and 0805, with low DCR, high Q factors, high SRF, and stable inductance values. Built with ceramic cores and magnet wire, these inductors provide excellent endurance against mechanical shock, pressure, and pull-up forces. Suitable for fully automated assembly, they are ideal for compact, high-performance electronic devices requiring precise impedance control across broad bandwidths.
Order the multicomp wire wound chip inductor MCFT000099 now for high-performance RF filtering in compact electronic devices. Ideal for cellular phones, WLAN, GPS, and RF modules, this inductor offers high SRF, high Q, low DCR, and outstanding mechanical endurance. Manufactured with ceramic core and magnet wire construction, it ensures stable inductance and reliable operation across a wide temperature range. Perfect for automated SMT assembly, it guarantees consistent performance for demanding RF applications in modern electronic systems.
You can click on the BUY or RFQ button to purchase MCFT000099 from an authorized MULTICOMP PRO distributor.
You can download the MCFT000099 datasheet or visit the MULTICOMP PRO website for support.
MULTICOMP PRO