This high-performance polyimide thermal interface pad offers excellent thermal conductivity of 2W/mK, electrical insulation, and long-term stability. Light grey in color, it features variable thickness options from 0.5mm to 3mm, making it suitable for cooling applications in electronic devices. Capable of operating within temperatures from -50°C to +200°C, the pad provides V-0 flame rating, high dielectric strength, and good tensile properties. It is RoHS compliant and ideal for efficient heat dissipation in demanding industrial, automotive, and electronic systems.
Enhance your thermal management with the Polyimide Thermal Interface Pad, offering 2W/mK thermal conductivity, excellent electrical insulation, and stable operation from -50°C to +200°C. With multiple thickness options, it provides optimal heat dissipation for electronic, automotive, and industrial applications. Its RoHS compliance ensures environmentally friendly use while maintaining long-term stability and good tensile properties. Available in standard 150mm x 150mm sizes, it is easy to install and ideal for high-performance electronic systems requiring efficient heat transfer and insulation.
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You can download the MPGCS020PI15020 datasheet or visit the MULTICOMP-PRO website for support.
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