MULTICOMP-PRO MPGCS050FGP30CC Thermal Gap Putty

This formable gap putty effectively fills irregular surfaces between heat sources and sinks, enhancing thermal contact and heat transfer. It remains in place without flowing after setting, providing superior contact and high thermal conductivity of 5 W/mK. Ideal for applications in communications, automotive electronics, mainframe, and cooling modules, it withstands operating temperatures from -40°C to +200°C. The grey thermal gap filler is dispensed from a 30ml container. It improves heat dissipation by completely sealing air gaps and voids for reliable thermal management in electronic systems.

View MPGCS050FGP30CCDatasheet [pdf]

Buy the Multicomp Series Gap Putty: MPGCS050FGP-30cc

Purchase the Multicomp Series Gap Putty MPGCS050FGP-30cc online for efficient thermal management in electronic devices. This grey, high-conductivity putty fills gaps and voids between heat sources and sinks, improving heat transfer and system reliability. Its non-flowing, moldable consistency ensures a perfect fit for irregular surfaces, making it suitable for automotive electronics, communications equipment, mainframes, and cooling modules. The product supports operating temperatures from -40°C to +200°C and is RoHS compliant, offering a safe, effective solution for thermal interface applications.

Order your Multicomp Series Gap Putty MPGCS050FGP-30cc today and ensure optimal heat transfer and reliable electronic performance.