MULTICOMP-PRO MPGCSP15USGF20010 Thermal Interface Pad

This high-performance glass fibre thermal interface pad offers excellent thermal conductivity of 1.5W/mK, long-term stability, electrical insulation, and good tensile properties. Its soft, rubber-like structure makes it suitable for efficient heat transfer between electronic components and heat sinks, providing reliable thermal management in various electronic devices. The pad is RoHS compliant, with a red color for easy identification, and operates within a temperature range of -50°C to +200°C. Available in different thicknesses, it ensures versatile application options for electronics cooling solutions.

View MPGCSP15USGF20010Datasheet [pdf]

Buy the Multicomp Series Thermal Interface Pad: MPGCSP15USGF20010

Purchase your Multicomp Series thermal interface pad today online to ensure optimal heat transfer in your electronic devices. These pads provide 1.5W/mK thermal conductivity, excellent stability, and electrical insulation in various thicknesses up to 3mm. They are RoHS compliant and operate from -50°C to +200°C, making them ideal for efficient thermal management. Ensure your electronic equipment runs reliably with a high-quality, easy-to-install thermal interface solution—order now and improve your project’s cooling performance seamlessly.

Order your Multicomp Series thermal interface pad today and enhance your electronic cooling solutions with reliable, high-performance thermal management components.