MULTICOMP-PRO MPGCSP15USGF20015 Thermal Interface Pad

The Glass Fibre Thermal Interface Pad is an ultra-soft, high-performance red pad with a thermal conductivity of 1.5W/mK. It provides excellent long-term stability, good tensile properties, and electrical insulation, making it suitable for thermal management in electronic devices. The pad offers a thickness range from 0.5mm to 3mm, ensuring proper fit and efficient heat transfer. It withstands operating temperatures from -50°C to 200°C and is rated V-0 for flame resistance. Ideal for enhancing cooling in high-performance electronics, this thermal pad ensures reliable thermal conductivity and insulation.

View MPGCSP15USGF20015Datasheet [pdf]

Buy the Multicomp Series Thermal Interface Pad: MPGCSP15USGF20015

Enhance your electronic device cooling with the high-quality Multicomp Thermal Interface Pad. Featuring a thermal conductivity of 1.5W/mK, available in multiple thicknesses up to 3mm, and capable of operating from -50°C to 200°C, this high-performance pad offers excellent stability, electrical insulation, and flame rating V-0. Its soft, conformable material ensures efficient heat transfer and long-lasting durability, making it ideal for thermal management in electronics and high-power applications. Purchase online today for dependable insulation and heat dissipation.

Order your Multicomp Series Thermal Interface Pad MPGCSP15USGF20015 today and improve your electronic cooling solutions with reliable thermal performance.