MULTICOMP-PRO MPGCSP30NS20015 Thermal Interface Pad

This high-performance, non-silicone thermal interface pad is designed for efficient heat transfer in electronic devices. Featuring a thermal conductivity of 3W/mK, it offers excellent material stability, electrical insulation, and compatibility with high temperatures up to 125°C. The light grey pad is available in various thicknesses from 0.5mm to 3mm, measuring 200mm x 200mm. Its low thermal impedance of less than 0.25°C-in7/W ensures effective thermal management, making it suitable for high-temperature, low-pressure applications in electronic and industrial equipment.

View MPGCSP30NS20015Datasheet [pdf]

Buy the Buy multicomp Thermal Interface Pad Part Number MPGCSP30NS20015 Online

Purchase the multicomp thermal interface pad MPGCSP30NS20015 online today for efficient heat dissipation in electronic devices. With a thermal conductivity of 3W/mK, this light grey pad provides excellent thermal management, electrical insulation, and stability at high temperatures up to 125°C. Available in multiple thicknesses from 0.5mm to 3mm and measuring 200mm x 200mm, it is ideal for high-performance applications in industrial and electronic equipment. Order now for dependable, high-quality thermal solutions.

Order your multicomp series MPGCSP30NS20015 high-performance thermal pad today and enhance your electronic cooling with reliable, RoHS-compliant thermal management solutions.