MULTICOMP-PRO MPGCSP30NS20020 Thermal Interface Pad

This non-silicone thermal interface pad offers high performance with a thermal conductivity of 3W/mK, suitable for high temperatures and low pressures. Its light grey color and variable thickness (0.5mm to 3mm) make it ideal for electrical insulation and effective heat transfer in electronic applications. The pad features good material stability, dielectric strength of 6kV/mm, dielectric constant of 12, and volume resistivity of 1012 Ohm.cm, operating safely within -40°C to +125°C. With excellent thermal impedance (<0.25°C-in7/W), it’s suitable for use in electronic devices requiring reliable thermal management.

View MPGCSP30NS20020Datasheet [pdf]

Buy the multicomp U+2013 Reliable Thermal Interface Pads for Industrial Applications

Enhance your thermal management with multicomp's high-performance non-silicone thermal interface pads. Designed for reliability, they feature 3W/mK thermal conductivity, excellent electrical insulation, and stability across a wide temperature range. Available in various thicknesses up to 3mm, these grey pads provide excellent heat transfer and impedance characteristics for electronic assembly. Perfect for high-temperature applications, they ensure efficient heat dissipation in electronic devices, maintaining optimal performance and longevity. Buy online now for quality thermal solutions.

Get multicomp thermal interface pads today—built for precision and long-lasting durability in electronic cooling solutions.