The Ultra Soft Thermal Pads are green, high-performance thermal interface materials with a thermal conductivity of 12.5 W/mK. They offer low thermal resistance, high compressibility, and electrical insulation, making them ideal for high power electronic applications. Suitable for use with ICs, CPUs, MOSFETs, LEDs, motherboards, power supplies, heat sinks, LCD TVs, notebooks, telecom devices, and wireless hubs, these pads provide effective heat dissipation. Thicknesses range from 0.5mm to 2mm, adhering to UL94 V-0 flame rating and ASTM standards for dielectric breakdown, weight loss, and density, working efficiently at -50°C to +150°C.
Order Multicomp Pro thermal pads today and experience top-tier thermal management for electronics. Available in various thicknesses, these green, high thermal conductivity pads are ideal for cooling ICs, CPUs, and power supplies. They feature low thermal resistance, high compressibility, electrical insulation, and meet UL94 V-0 flame rating standards. Perfect for applications like motherboards, heat sinks, LED lighting, and telecom devices, these pads ensure reliable, efficient heat dissipation in demanding environments. Purchase online now for fast delivery and quality assurance.
You can click on the BUY or RFQ button to purchase MPTGA125015020 from an authorized MULTICOMP-PRO distributor.
You can download the MPTGA125015020 datasheet or visit the MULTICOMP-PRO website for support.
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