The Ultra Soft Thermal Pads multicomp?ro are high-performance thermal interface materials designed for efficient heat transfer in electronic applications. These red-colored pads feature a thermal conductivity of 14.5 W/mK and are ideal for high power devices such as ICs, CPUs, MOSFETs, LEDs, motherboards, power supplies, and heat sinks. With customizable thickness options from 0.5mm to 2mm, they provide low thermal resistance, electrical insulation, and excellent flexibility. Certified V-0 flame rating, dielectric breakdown voltage of 4 kV/mm, and operating temperature range from -50°C to +150°C make them suitable for demanding electronic environments.
Experience efficient cooling with our Multicomp Series thermal pads, ideal for high power electronics. With excellent thermal conductivity, low thermal resistance, and electrical insulation, these pads ensure optimal heat transfer. Available in various thicknesses from 0.5mm to 2mm, they are easy to cut and install, providing a reliable solution for ICs, CPUs, and power modules. Certified V-0 flame rating and operating temperatures up to 150°C make them perfect for demanding applications. Buy online now and enhance your electronic device performance.
You can click on the BUY or RFQ button to purchase MPTGA145015010 from an authorized MULTICOMP PRO distributor.
You can download the MPTGA145015010 datasheet or visit the MULTICOMP PRO website for support.
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