The Ultra Soft Thermal Pads are yellow, highly conformable thermal interface materials with a thermal conductivity of 3.5 W/mK, suitable for high power electronic applications. They provide excellent thermal management for components such as ICs, CPUs, MOSFETs, LEDs, motherboards, power supplies, heat sinks, LCD TVs, notebooks, telecom devices, and wireless hubs. Available in various thicknesses from 0.5 mm to 3 mm, these pads feature high compressibility, dielectric breakdown voltage of 6 kV/mm, and operate reliably between -50°C and +150°C. Their flame rating is V-0, and they are RoHS compliant, ensuring safety and environmental standards.
Order the multicomp Ultra Soft Thermal Pads online today to ensure optimal thermal management for your electronic devices. These yellow thermal interface materials feature a 3.5W/mK thermal conductivity, are available in thicknesses from 0.5mm to 3mm, and are designed for high power applications. Their high conformability ensures excellent contact with components like ICs, CPUs, and heat sinks. RoHS compliant and with a V-0 flame rating, these pads provide reliable insulation and thermal performance, making them an essential part of your electronics cooling solutions.
You can click on the BUY or RFQ button to purchase MPTGA350015005 from an authorized MULTICOMP-PRO distributor.
You can download the MPTGA350015005 datasheet or visit the MULTICOMP-PRO website for support.
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