The MICROCHIP TECH. COM20019I-DZD is a 28L PLCC connector designed for various electronic applications. It undergoes rigorous qualification testing, including moisture/reflow sensitivity classification and temperature cycling, ensuring reliable performance. The connector's construction includes a 15 mil die thickness, 129.5 x 144.5 mils die size, and utilizes Au wire and G600V mold compound. It is assembled by MMT and features a matte tin plating finish, suitable for a wide range of industrial and commercial applications.
You can click on the BUY or RFQ button to purchase COM20019IDZD from an authorized Microchip Technology distributor.
You can download the COM20019IDZD datasheet or visit the Microchip Technology website for support.
Microchip Technology