The CLP series are low-profile dual wipe sockets designed for high-reliability PCB connections with a compact height of 2.21 mm. Made from black liquid crystal polymer insulator with phosphor bronze contacts, these sockets feature tin or gold plating over 50 micro inches of material. They support operating temperatures from -55°C to +125°C, with a current rating of 4A per pin and a voltage rating of up to 395V. Suitable for pass-through applications, they offer easy mounting, high cycle life, RoHS compliance, and are ideal for micro pitch, high-density PCB assemblies across a wide range of industries.
Insertion Depth: Top Entry 1.40 mm, Bottom Entry 2.41 mm, DH Entry 2.34 mm to 2.67 mm
Normal Force: 60 grams (0.59 N) average
Max Cycles: 100 with 10 микрон gold
RoHS Compliant: Yes
Lead-Free Solderable: Yes
SMT Lead Coplanarity: 0.10 mm max
Compatibility: Mates with Tiger Claw contacts 1.27 mm x 1.27 mm, 050" x 0.050" micro pitch
Dimensions: Height 2.21 mm, Diameter 4.00 mm
Number of Positions: 5 minimum
Suitable for pass-through and bottom entry applications
RoHS compliant, high cycle life, and suitable for PCB maintenance
Buy the Buy Samtec CLP-107-02-F-D-P Part Number CLP10402GD Online
Discover the convenience of buying the Samtec CLP series PCB sockets online, designed for high-reliability, micro pitch applications, and supporting operating temperatures from -55°C to +125°C. These low-profile dual wipe sockets feature durable phosphor bronze contacts with Sn or Au plating over 50 micro inches, ensuring excellent electrical contact and long cycle life. RoHS compliant and lead-free, they are ideal for high-density PCB assembly, pass-through, and bottom entry applications, providing secure connections for demanding electronic projects.
Buy Samtec CLP-107-02-F-D-P now and experience unmatched reliability with high-density, low-profile PCB socket solutions.
Frequently Asked Questions
Where can I buy SAMTEC CLP10402GD?
You can click on the BUY or RFQ button to purchase CLP10402GD from an authorized SAMTEC distributor.
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