This versatile board stacker series features high reliability, with gold and tin plating options, operating temperature ranges from -55°C to +125°C, and compliance with RoHS. Designed to mate efficiently with various connectors, these stackers are suitable for high-density applications, offering mechanical stability and robust electrical performance. Constructed with high-quality phosphor bronze and insulating materials like black glass-filled polyester and crystal polymer, they provide durability and optimal electrical conductivity in demanding environments, ensuring secure connections and seamless integration into complex electronic systems.
Material: Phosphor Bronze with Au or Sn over Ni plating
Insulator Material: Black Glass-filled Polyester and Crystal Polymer
Operating Temp Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
Dimensions: Length varies, typical pin spacing 2.54 mm (.100 inch), length 7.87 mm (0.309 inch)
Plating Thickness: 50 micro-inch (1.27 µm) gold, tin over nickel
RoHS Compliant: Yes
Wave Solderable: Yes
Part Configuration: Stacking with multiple rows, various heights
Certifications: RoHS Compliant
Mechanical Stability: Recommended with mechanical board spacers in gold plated applications
Design: Non-standard, non-returnable, suitable for high-density circuit boards
Buy the Buy Samtec Board Stacker Part Number DW0313GD906 Online
Experience the secure and reliable connection capabilities of this high-density board stacker, featuring gold and tin plating options, RoHS compliance, and robust construction. Designed for demanding electronic applications, it offers excellent mechanical stability, easy installation, and excellent electrical conductivity. Whether for complex circuits or compact systems, this stacker ensures durable performance, consistent electrical contact, and seamless integration. Purchase online today to enhance your electronic assembly with top-quality connectivity parts designed for durability and precision.
Buy Samtec DW0313GD906 now and experience unmatched reliability and performance in high-density electronic connections.
Frequently Asked Questions
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