The DWM1154SD300 is a high-density, surface-mount stacker connector designed for through-hole board stacking and SMT applications. Built with phosphor bronze terminal material and plated with gold or tin, it operates within temperature ranges of -55°C to +105°C (tin) and -55°C to +125°C (gold). Featuring a compact design with varying height options, it ensures excellent coplanarity and mechanical stability for high-reliability electronic assemblies. Suitable for RoHS-compliant, lead-free applications, this connector provides versatile options for modern electronic systems requiring robust, space-efficient interconnections.
Operating Temperature Range: -55°C to +105°C with Tin, -55°C to +125°C with Gold
RoHS Compliance: Yes
Lead-Free Solderable: Yes
Board Stack Height Options: Various (typical height options) ranging up to 19.18 mm
Number of Pins: Multiple configurations available (up to 50+ pins depending on model)
Surface Mount and Through-Hole Compatibility: Yes
Co-planarity: Not specified but designed for high-density alignment
Mechanical Stability: Enhanced with optional mechanical board spacers
Certifications: RoHS compliant
Notes: Mechanical stability recommended with spacers for gold-plated models, subject to change without notice
Buy the Buy Samtec Connector Part Number DWM1154SD300 Online
Order the Samtec DWM1154SD300 high-density stack connector online today and enjoy quick delivery, exceptional build quality, and reliable interconnection solutions. Designed for surface mount and through-hole applications, it features a compact form factor with multiple height options, making it ideal for space-constrained electronics. Its gold or tin plating ensures excellent conductivity and corrosion resistance, while RoHS compliance guarantees environmentally friendly manufacturing. Upgrade your electronic assemblies with this versatile connector, supporting high-speed data transfer and robust physical connection for demanding modern devices.
Buy Samtec DWM1154SD300 connector now and experience unmatched reliability and space-saving performance for your high-density electronic assemblies.
Frequently Asked Questions
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